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Analysis of Stress Singularity on Adhensively Bonded Interfaces in the Dissimilar Materials by BEM
박철희(인천대학교); 신관수(인천대학교)
17권 1호, 23~30쪽
초록
Adhensively bonded joints in dissimilar materials have been widely applied in various engineeringfields such as automobiles, space vehicle, semiconductor, vessel. To establish a fracture criterion and areasonable strength evaluation method on adhensively interfaces in dissimilar materials, it is necessary toassess fracture parameters with various bonding conditions. In this paper, through stress analysis by usingthe 2-dimensional elastic boundary element method(BEM), the stress singularity factors on adhensivelybonded joint in dissimilar materials were investigated quantitatively, and suggested the strength evaluationmethod by using fracture parameters.
Abstract
Adhensively bonded joints in dissimilar materials have been widely applied in various engineeringfields such as automobiles, space vehicle, semiconductor, vessel. To establish a fracture criterion and areasonable strength evaluation method on adhensively interfaces in dissimilar materials, it is necessary toassess fracture parameters with various bonding conditions. In this paper, through stress analysis by usingthe 2-dimensional elastic boundary element method(BEM), the stress singularity factors on adhensivelybonded joint in dissimilar materials were investigated quantitatively, and suggested the strength evaluationmethod by using fracture parameters.
- 발행기관:
- 한국기계항공기술학회
- 분류:
- 기계공학