Epoxy/Phenolic resin을 활용한 메타-아라미드 시트지와 금속 소재의 내열접착성 향상
Improvement of Heat Resistant of Adhesion between m-Aramid Sheet and Metal Materials using Epoxy/Phenolic Resin
강찬규(한경국립대학교); 채주원(스타텍스); 최승진((주)한양에코텍); 이지수(영남대학교 파이버시스템공학과); 김삼수(영남대학교 파이버시스템공학과); 이상오(영남대학교 의류패션학과); 이재웅(영남대학교)
34권 3호, 157~164쪽
초록
This study tried to analyze the heat resistance properties by blending epoxy and phenolic resin in a certain ratio, and to analyze the adhesive properties at the time of metal-polymer hetero-adhesion by applying Epoxy-phenolic resin between a silicon steel sheet and m-aramid sheet, the viscosity, adhesive peel strength, and adhesive cross section were measured using a rotational rheometer, a tensile tester(UTM), and a field emission scanning electron microscopy(FE-SEM). The thermal stability and heat resistance were confirmed by measuring the mass loss according to the temperature increase using Thermogravimetric analysis(TGA). After blending with epoxy and Phenolic resin(1:0.25 ratio) curing at 110℃ for 10 min, high adhesive strength was improved more than 40% compared to the adhesive strength using epoxy alone. When the space between the silicon steel sheet and m-aramid sheet, which is created during curing of the E-P blend, is cured with a slight weight, it is possible to control the empty space and improve adhesion.
Abstract
This study tried to analyze the heat resistance properties by blending epoxy and phenolic resin in a certain ratio, and to analyze the adhesive properties at the time of metal-polymer hetero-adhesion by applying Epoxy-phenolic resin between a silicon steel sheet and m-aramid sheet, the viscosity, adhesive peel strength, and adhesive cross section were measured using a rotational rheometer, a tensile tester(UTM), and a field emission scanning electron microscopy(FE-SEM). The thermal stability and heat resistance were confirmed by measuring the mass loss according to the temperature increase using Thermogravimetric analysis(TGA). After blending with epoxy and Phenolic resin(1:0.25 ratio) curing at 110℃ for 10 min, high adhesive strength was improved more than 40% compared to the adhesive strength using epoxy alone. When the space between the silicon steel sheet and m-aramid sheet, which is created during curing of the E-P blend, is cured with a slight weight, it is possible to control the empty space and improve adhesion.
- 발행기관:
- 한국염색가공학회
- 분류:
- 염색공학