SK하이닉스의 동태적 경쟁우위에 관한 연구: HBM 사업을 중심으로

This exploratory research focuses on dynamic change of competitive advantage in high technology industry. In other words, single case study was carried out to reveal the source of competitive advantage in which how to SK Hynix catch up and overcome Samsung Electronics in the field of HBM memory. In case of AI chip, it was indispensable to process a large volume of data and also deliver customer-oriented systematic chip. According to dynamic capability view, that is, sensing, seizing and reconfiguring/transforming, in-depth case study is to elaborate the success factor and process of creating competitive advantage. As a result, despite uncertain situation from technology and market, top management team led to make an entrepreneurial investment. Moreover, SK Hynix managed to develop process utilization and product stability and further retain firm-specific technology like hybrid bonding in order to make use of appropriability. Last but not least, SK Hynix preemptively established HBM business organization to serve total solution for major clients. In particular, SK Hynix will continue to make above-rate of return, in case of building global value chain with customer, supplier, foundry makers and planning HBM platform business model.